Thin films and coatings (from a few nm to about 1 μm thick) need to be optimised both in the mechanical properties and tribological performance.Typically, this is done with a combination of indentation and scratch tests.Conventional scratch test conditions are not appropriate for these types ofmaterials as they were developed for testing thicker coatings. Instead thenano-scratch & wear module can provide what is needed. Figure 1: Ramped scratches to 500 mN show brittle fracture of 1.5 μm TiFeN films on Si at high load.
薄膜和涂層(從幾納米到約1微米厚)在機(jī)械性能和摩擦學(xué)性能方面都需要優(yōu)化。通常，這是通過壓痕和劃痕測(cè)試的組合來完成的。傳統(tǒng)的劃痕試驗(yàn)條件不適用于這些類型的材料，因?yàn)樗鼈兪菫闇y(cè)試較厚的涂層而開發(fā)的。相反，納米劃痕和磨損模塊可以提供所需的東西。
圖1:500 mN的傾斜劃痕顯示，在高負(fù)載下，Si上1.5 μ m的TiFeN薄膜脆性斷裂。
How it works
The sample to be tested is moved perpendicular to the scratch probe whilstthe contact is either held constant or ramped at a user-defined rate.Throughout the test the probe penetration depth and tangential (frictional)load are continuously monitored. Single and multi-pass tests are possible. Multi-pass tests allow the investigation of nano-wear and micro-wear.
The Nano-Scratch & Wear module has found many applications in sectorsas diverse as optical, microelectronics, polymer/biomaterial, and tribologicalcoatings. It is available as a stand alone instrument (nano-scratchtester) or as an option for the NanoTest Vantage platform.
運(yùn)作原理
待測(cè)樣品垂直于劃痕探針移動(dòng)，同時(shí)接觸保持恒定或以用戶定義的速率傾斜。在整個(gè)測(cè)試過程中，探針穿透深度和切向(摩擦)載荷被持續(xù)監(jiān)測(cè)?？梢赃M(jìn)行單次和多次測(cè)試。多道次試驗(yàn)可以研究納米磨損和微磨損。
納米劃痕和磨損模塊在光學(xué)、微電子、聚合物/生物材料和摩擦學(xué)涂層等領(lǐng)域得到了廣泛應(yīng)用。它可以作為一個(gè)獨(dú)立的儀器(納米劃痕儀)或作為NanoTest Vantage平臺(tái)的一個(gè)選項(xiàng)。
Ramped scratch, corrected for baseline sampletopograp
Figure 2 shows a scratch test with 3 μm end radius probe scanning over a 150 μm track at a scan speed of 2 μm/s.
A pre-scratch scan was carried out using an ultra low contact force inorder to assess baseline sample topography.
The red line shows the on-load probe depth, which represents elastic and plastic depth. After 20 μm the load is ramped at 2.5 mN/s.
The black line shows the residual (plastic) depth once the scratch loadhas been removed. This has been corrected for initial sample topography.
The frictional force on the indenter can be recorded throughout theexperiment.
斜坡劃痕，根據(jù)基線樣本地形進(jìn)行校正
圖2顯示了用3μm末端半徑探針在150μm軌道上掃描的劃痕測(cè)試，掃描速度為2μm/s。
使用超低接觸力進(jìn)行預(yù)刮擦掃描，以評(píng)估基線樣品地形。
紅線為有載探頭深度，表示彈塑性深度。在20μm后，負(fù)載上升到2.5mN/s。
黑線顯示一旦劃痕載荷被移除后的殘留(塑料)深度。這已經(jīng)對(duì)初始樣品地形進(jìn)行了校正。
壓頭上的摩擦力可以在整個(gè)實(shí)驗(yàn)過程中記錄下來。
Micro-scratch Testing
The 30 N high load head can be used across the full load range formicro-scratch and micro-wear testing. The frictional force on the indenter canalso be recorded throughout the entire load range.
This high load scratch capability is available on NanoTest Vantage and NanoTest Xtreme instrumentsequipped with the high load head.
Check out our high temperature micro-scratch and impact testing tech note whichdescribes case studies that combine the proven NanoTest high temperaturecapability with micro-scale scratch and impact tests on hard, wear-resistantcoatings.
Micro-scratch 測(cè)試
30 N高負(fù)載頭可用于全負(fù)載范圍的微劃痕和微磨損測(cè)試。壓頭上的摩擦力也可以在整個(gè)負(fù)載范圍內(nèi)記錄。
這種高負(fù)載劃痕能力可用于配備高負(fù)載頭的NanoTest Vantage和NanoTest Xtreme儀器。
請(qǐng)查看我們的高溫微劃痕和沖擊測(cè)試技術(shù)說明，其中描述了將經(jīng)過驗(yàn)證的NanoTest高溫可重性與硬質(zhì)耐磨涂層的微劃痕和沖擊測(cè)試相結(jié)合的案例研究。